Founded in 2006 by material science and engineering scientist in Ningbo, China, Sibranch Microelectronics aims to provide semiconductor wafer and service all over the world.
Our main products including standard silicon wafers SSP (single side polished), DSP (Double side polished), test silicon wafers and prime silicon wafers, SOI (Silicon on Insulator) wafer and coinroll wafers with diameter up to 12 inch, CZ/MCZ/FZ, Neutron radiation, almost any orientation, off cut, high and low resistivity, ultra flat, ultra thin, thick wafers, etc.
In addition, our team offers film deposition services (Oxide, Nitride, Metal), silicon epitaxial wafers and epitaxial services (SOS, GaN, GOI etc), downsizing, back grinding, dicing, etc.
We also supply wafers below:
Sapphire wafers: 2 to 6 inch, A-plane, R-plane, M-plane, C-plane, epi-polish, fine ground, etc.
GaAs wafers: 2 to 6 inch, P&N type, semi-conducting, semi-insulating, etc.
SiC wafers: 2 to 4 inch, 4H-N, 6H-N, 6H-SI, etc.
Glass wafers: 2 to 8 inch Fused Silica, Borofloat, B270 etc.
Single crystal quartz wafers: 2-6 inch, X-cut, Y-cut, Z-cut, etc.
Products
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